I've gotten a lot of use out of that probe. Purchased at my 'local' electronics supply store for around $40. I have a multimeter with thermocouple probe, Extech EX330. I manually reflow also using Kester EP256, Temps are way too high and times are too long. None of the other components (including the one shown) required resoldering. I resoldered the USB micro receptacle and the board now works.
The I'm also still getting the error "Device not responding to setup address." in the Linux kernel ring buffer. I'm having some trouble getting more of the flux off than this using a toothbrush and isopropyl alcohol. Here's the same component after cleaning. Does that mean that my ramp rate is too high, or I didn't hold the temperature at about 150C for long enough? The other mistake I may have made is I only took the solder paste out of the fridge for about 1 hour before soldering.ĭo these diagnoses sound accurate? Anything else that comes to mind? I hope the image is sufficiently clear, but if not let me know what is unclear and I will see if I can take a better picture to satisfy those criteria.
For instance, it looks like there might be some mild solder-bridging from solder-ball formation (note that the top left two pins should be bridged). However, I wonder if I might have made other mistakes as well. The obvious first mistake I made is to let the temperature get above 235C. However, my oven exceeded the max temperature and got up to 247C before I opened the door. My solder temperature profile is (using Sn63/Pb37 ChipQuik solder paste): I'm trying to diagnose what went wrong in order to solder this correctly the next time. As you can see in the image below, I botched the job and burned the solder connections (not surprisingly, the board does not work). I made a homemade reflow oven and used it for the first time to solder a board.
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